Single- and double-sided PCBs
Your direct benefit: Manufacture according to standard parameters
- Time and cost savings through reduced design and work preparation workload
- Yield optimisation on both sides
- Clear and unambiguous communication
- Stable transition from prototype to series production
new: our standard parameters summarized as Basic Design Guide
new: Poster Basic Design Guide: see here the digital version or order here for free!
| Properties |
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|---|---|---|
| max. circuit board size | 570 x 500 mm | 1150 x 550 mm |
| circuit board thickness |
max. 2.4 mm* min. 0.5 mm |
max. 4.5 mm min. 0.5 mm |
| copper cladding (base copper) | 18 µm, 35 µm, 70 µm, 105 µm | 18 µm - 210 µm |
| material | FR4 (TG 135, TG 150, TG 170) | FR4 (TG 135, TG 150, TG 170), RF |
| surface finishes | HAL,HAL lead-free, electroless nickel/immersion gold, immersion tin, immersion Ag, gold finger, ENEPIG | HAL,HAL lead-free, electroless nickel/ immersion gold, immersion tin,immersion Ag, OSP, gold finger, ENEPIG |
| min. conductor track width and distance |
100/100 µm (standard) 75 µm (min) |
100/100 µm (standard) 75 µm (min) (18 µm base copper) |
| aspect ratio (hole diameter : circuit board thickness) | 1 : 8 | 1 : 12 |
| additional printing |
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| * greater thickness upon request |
| Documentation |
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|---|---|---|
| Inspection certificate |
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| Factory inspection certificate |
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| Initial sample inspection “standard” |
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| Initial sample inspection “thorough” (customized) |
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Lead-free |
Layer thickness |
Layer thickness |
Shelf life |
Comments |
|
|---|---|---|---|---|---|
|
Hot Air Leveling (HAL) |
No (HAL SnPb) | 1 ... 40 μm | 1 ... 40 μm |
12 months |
|
| Hot Air Leveling (HAL) | Yes | 1 ... 40 μm | 1 ... 40 μm | 12 months |
|
| Chemical nickel-gold cNiAu | Yes |
4 ... 7 μm Ni 0.075 … ± 0.025 μm Au |
min. 3 μm Ni min. 0.05 μm Au |
12 months |
|
| Chemical tin cSn | Yes | 0,8 ... 1,1 μm | ≥ 1.0 μm | 6 months |
|